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Brand Name : Betterliv/OEM
Model Number : OEM
Certification : ISO9001 FCC
Place of Origin : Shenzhen,China
Payment Terms : T/T, Western Union, Credit Card
Layer : 6
Min. Line Width : 8mil
Base Material : FR4 TG130
Copper Thickness : 1OZ
Surface finish : ENIG
Board thickness : 1.6mm
Fast Custom 6 Layers HDI Buried Blind Vias Hole PCB Quick Turn PCB Assembly For Eelectrical Products
PCB Manufacture Capability
| Layers | 6 Layers | 
| Material | FR4 TG130 | 
| Copper thichness | 1oz | 
| Board thickness | 1.6mm | 
| Min. Hole Size | 0.3mm | 
| Min. Line Width | 8mil | 
| Min. Line Spacing | 8mil | 
| Surface Finish | ENIG | 
| S/M Color | Blue | 
| Special Process | HDI, BVH, back drill, pressfit hole, edge plating, VOP, counter sunk, half hole, gold plating, gold finger, ENIG+OSP, flex board, rigid-flex board | 
Our service
We are manufacturer, specializing in PCB and PCBA R&D and production.
• Electronic components material purchasing
• Bare PCB fabrication
• PCB Assembly Service. (SMT, DIP)
• FULL Test: AOI, X-Ray, In-Circuit Test (ICT), Functional Test (FCT)
• Conformal coating service
• Prototyping and mass production...
• PCB layout, PCBA design according to your idea
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| TG130 6 Layer PCB Board ENIG Surface finish HDI Buried Blind Vias Hole Images | 
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